Mems

Micro-Electro-Mechanical Systems (MEMS) are a engineering that embeds mechanical tresss such as fluid sensors, mirrors, actuators, pressure and temperature sensors, frisson sensors and valves in semiconductor chips. MEMS technology embeds mechanical devices such as fluid sensors, mirrors, actuators, pressure and temperature sensors, vibration sensors and valves in semiconductor chips using standard micro fictionalization techniques. MEMS are made up of components between 1 to cytosine micrometers in surface and MEMS devices generally range in size from 20 micrometers to a millimeter. They usually consist of a central unit that processes data, the microprocessor and several components that interact with the outside such as micro sensors.[1] At these size scales, the standard constructs of classical physical science are not always useful. Because of the large surface battleground to volume ratio of MEMS, surface effects such as electrostatics and wetting dominate volume effects such as inertia or thermal mass. MEMS technology, depending on target device and market sector, can be implemented using a number of different materials and manufacturing techniques. [2]
Silicon is the material most use in MEMS manufacturing because of its inexpensive price.



It is used to create Integrated Circuits (IC). In single crystal form, silicon is an almost perfect Hookean material, center that when it is flexed there is virtually no hysteresis and hence almost no energy dissipation. As well as making for highly repeatable motion, this also makes silicon very reliable as it suffers very little fatigue and can have answer lifetimes in the range of billions to trillions of cycles without breaking. The basic techniques for producing all silicon establish MEMS devices are deposition of material layers, patterning of these layers by photolithography and then engraving to produce the required shapes. [3]If you want to get a all-encompassing essay, order it on our website: Orderessay



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